Encapsulation & Potting
Our Design and Manufacturing teams have developed specialised techniques for potting and encapsulation of a variety of complex and often delicate or static sensitive components including PCBs, switches and sensors. These processes are usually required to provide a barrier to liquid or gaseous material ingress and mechanical protection of the potted parts.
This expertise has been developed over 30 years and as such we have gained a broad knowledge of materials and methods to suit diverse products and applications.
Encapsulated and potted products include but are not limited to :
- Printed circuit assemblies (PCAs)
- Pressure Sensors
- Piezo electric transducers and hydrophones
- Electrical coils
- Glass-to-metal seals
- Penetrator Inserts and Waterblocks