Subsea

Encapsulation & Potting

Our Design and Manufacturing teams have developed specialised techniques for potting and encapsulation of a variety of complex and often delicate or static sensitive components  including PCBs, switches and sensors. These processes are usually required to provide a barrier to liquid or gaseous material ingress and  mechanical protection of the potted parts.

This expertise has been developed over 30 years and as such we have gained a broad knowledge of materials and methods to suit diverse products and applications.
Encapsulated and potted products include but are not limited to :

  • Printed circuit assemblies (PCAs)
  • Microswitches
  • Pressure Sensors
  • Piezo electric transducers and hydrophones
  • Electrical coils
  • Glass-to-metal seals
  • Penetrator Inserts and Waterblocks

Please contact us to discuss your encapsulation and potting requirements.


Membership and Accreditations: